Equipment Name: Ultrasonic Scanning Microscope

Device model: D9650

Sonic probe frequency: 5M to 400M

Ultrasound scanning mode: A-Scan (point scan), B-Scan (block scan), C-Scan (layer scan), Multi-Scan (multi-layer scan), Q-BAM (virtual cross-section), T-Scan (Transparent Scanning), 3-V (3D Image), Tray-Scan (Disc Scanning)

Maximum scanning range: 12.9X12.4 inches

Applicable objects: semiconductor chip delamination analysis, plastic package delamination analysis